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NTB75N03R, NTP75N03R
Power MOSFET
75 Amps, 25 Volts
N?Channel D 2 PAK, TO?220
Features
? Planar HD3e Process for Fast Switching Performance
? Low R DS(on) to Minimize Conduction Loss
? Low C iss to Minimize Driver Loss
? Low Gate Charge
? Pb?Free Packages are Available
MAXIMUM RATINGS (T J = 25 ° C Unless otherwise specified)
http://onsemi.com
75 AMPERES
25 VOLTS
R DS(on) = 5.6 m W (Typ)
4
Parameter
Symbol
Value
Unit
4
Drain?to?Source Voltage
Gate?to?Source Voltage ? Continuous
V DSS
V GS
25
± 20
V dc
V dc
1
2
3
Thermal Resistance ? Junction?to?Case
Total Power Dissipation @ T C = 25 ° C
Drain Current
? Continuous @ T C = 25 ° C
? Single Pulse (t p = 10 m s)
R q JC
P D
I D
I DM
1.68
74.4
75
225
° C/W
W
A
A
1
2
3
TO?220AB
CASE 221A
STYLE 5
D 2 PAK
CASE 418B
Thermal Resistance ? Junction?to?Ambient
(Note 1)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
R q JA
P D
I D
60
2.08
12.6
° C/W
W
A
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Thermal Resistance ? Junction?to?Ambient
(Note 2)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
Operating and Storage Temperature Range
R q JA
P D
I D
T J , T stg
100
1.25
9.7
?55 to
° C/W
W
A
° C
4
Drain
4
Drain
150
75N03RG
Single Pulse Drain?to?Source Avalanche
Energy ? Starting T J = 25 ° C
E AS
71.7
mJ
P75N03RG
AYWW
AYWW
(V DD = 30 V dc , V GS = 10 V dc , I L = 12 A pk ,
L = 1 mH, R G = 25 W )
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from Case for 10 Seconds
T L
260
° C
1
Gate
2
3
Source
1
Gate
2
Drain
3
Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Drain
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1 inch pad size,
(Cu Area 1.127 in 2 ).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in 2 ).
xxxxxxx
G
A
Y
WW
= Device Code
= Pb?Free Device
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2006
June, 2006 ? Rev. 4
1
Publication Order Number:
NTB75N03R/D
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